At present, the flip-chip market is in the preliminary research test stage, from the initial small batch production to the current mass production. Nowadays, everyone's understanding of flipping has increased to a new height. Although the total demand is still unable to compete with the formal wear, its price is higher than the cost of dressing, but the market prospect is good.
In view of the current demand for precision and high price of flip-chip equipment, Taigong Electronic Machinery Technology Co., Ltd. developed a new generation of flip-chip bonding equipment jointly developed by Japan in June 2016--LEP with this press (Main Bonder For LEP).
“Compared to current flip-chip equipment, this device completely overturns the concept of existing flip-chip equipment, fits within a specific temperature range and pressure range, and combines special glue and improved technology to maximize Product yield, reducing the problem of product qualification due to process flow." According to the internal supervisor of the Taiwanese.
In addition, under the premise of ensuring the accuracy of the equipment, the equipment cost is controlled within the acceptable range of the customers, and the equipment operation is also simpler, especially for the fabrication process and cost requirements of the flip chip.
The latest products produced by Taiwan Laboratories have greater advantages than the current solder paste reflow products, mainly reflected in:
1, there will be no problem with dead lights, the current solder paste reflow soldering products in the process of the process there are many hidden lights hidden dangers;
2, the cost of using the chip is cheaper than the cost of flip chip, the process of chip production process is also simpler than the process of flip chip process;
3, the operation is simpler, simple operation makes the operator more comfortable;
4. The process of using the press-bonding process is higher and more stable than the current flip-chip soldering.
The following are some of the customers' evaluations.
Compared with the current reflow soldering process, the equipment and process technology have higher yield and stability, and lower cost. -- Deli Photoelectric
Process is simpler than existing flip-chip process -- Hongli Optoelectronics
Simple operation of equipment and correspondingly lower cost--Ruifeng Optoelectronics Co., Ltd.
In the COB and high-power market, the prospects are very broad -- Li Lin, Quality Director of Deli Optoelectronics
Prospects for plant lights and car lights are bright--Yi Jingyuan
About Taiwan Technology
Shanghai Taigong Semiconductor Technology Co., Ltd. and Dongguan Taigong Electronic Machinery Technology Co., Ltd. (hereinafter referred to as "Taigong Technology") were formally established in 2010. They are members of the National Semiconductor Equipment Manufacturing Standards Working Group and the National Semiconductor Equipment Manufacturing Engineering Research and Development. Member members of the Industrial Alliance, national high-tech enterprises, and core members of the LED Industry Standards Alliance are shouldering the heavy responsibility of the “12th Five-Year†National Science and Technology Support Program for semiconductor lighting projects and the strategic emerging industry projects for the Shanghai Modern Industry Top 500 Project.
Taigong Group has always adhered to the principle of leading technology, and established exchanges of talents with the Institute of Acoustics of the Chinese Academy of Sciences, Jiaxing Chinese Academy of Sciences, and Dongguan Institute of Technology to establish a breakthrough in the development of automation equipment, and truly achieve breakthrough development in semiconductor equipment, especially The research and development level in the LED field has reached the international advanced level, ensuring that the products are in line with the development frontier of global automation equipment.
Taigong Group has a wide-ranging and well-serviced marketing service network, Dongguan Headquarters, Shanghai Branch and various district offices, with marketing scope throughout China; meanwhile, with Shenzhen Changfang Semiconductor Lighting Co., Ltd. and Guangzhou Hongli Optoelectronics Co., Ltd. Internationally renowned semiconductor packaging companies such as Co., Ltd., Xiamen Xinda Co., Ltd., Shenzhen Jufei Optoelectronics Co., Ltd., Foshan Guoxing Optoelectronics Co., Ltd. have established a good strategic partnership and provided professional, fast and timely intimate services. Form the image brand of the Taiwanese workers.
In the face of the increasingly mature LED market, the Taiwan Industrial Group has always adhered to the belief of only doing high-end equipment, and won the praise of many domestic high-end customers and the industry. Facing the future, the Taiwan Industrial Group is taking a brand-new image, innovation as the driving force, market-oriented, environmental protection and energy saving as its mission, and strive to build a world-class Chinese LED packaging equipment brand.
Taigong, because of concentration, so professional!
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Dongguan ZhiChuangXing Electronics Co., LTD , https://www.zcxelectronics.com