Hua Technology has released a series of new Mini-ITX computing platforms with rich I/O interfaces and high performance image processing performance, which is ideal for retail, industrial automation and medical applications.
The high-performance Mini-ITX embedded motherboard supports the 4th generation Intel® CoreTM i7/i5/i3 desktop processor and the AMD® Embedded 2nd generation R Series APU. The motherboard is equipped with unique hardware features such as support for a PEG x16 card slot and an additional PCIe x1 I/O card slot, including a detachable BIOS chip, a vertical USB port for a secure dongle, and an adaptable SATA- DOM SATA slot. All boards support dual power inputs, allowing the use of a 12V-DC power supply or a standard ATX power supply. These motherboards also offer four serial ports (RS232/422/485) and multiple USB 2.0/3.0 ports.
The entry-level Mini-ITX embedded motherboards feature the latest Intel® AtomTM processors and support military wide temperature levels, operating from -40°C to +85°C, for industrial automation and medical applications.
“All ADLINK's Mini-ITX motherboards follow strict specifications, testing and functional design principles. When customers want to upgrade their next-generation Mini-ITX motherboards in the future, there is no need to change existing chassis and cables. Save time and resources, and reduce the cost of the solution,†said Henk van Bremen, senior director of the modular computing products business at ADLINK.
ADLINK's new Mini-ITX platform follows the industry registration design process, including high accelerated life testing (HALT), extended temperature testing, MIL-STD verification, shock and vibration testing. ADLINK's Mini-ITX embedded motherboard supports a 7-year product lifecycle.
All ADLINK's Mini-ITX embedded motherboards are paired with SEMA (Embedded Intelligent Management Tool) for local management and distributed device control. ADGA's products with SEMA capabilities can be seamlessly connected to our SEMA Cloud solution for remote monitoring, automated status analysis, custom data collection, and launching appropriate actions. All collected data, including sensor measurements and management commands, can be accessed with encrypted data, via the web interface or via the API, whenever and wherever.
The products can provide various specifications of rectifier bridge devices according to customer requirements. The electrical properties, appearance, reliability, safety indicators and environmental protection indicators of the products all meet the relevant standards.
Planar Die Construction Sealed Glass Case Ideally Suited for Automated Insertion - 75V Nominal Zener Voltages
Case: MiniMELF, Glass Terminals: Solderable per MIL-STD-202, Method 208 Polarity: Cathode Band Approx. Weight: 0.05 grams= 25°C unless otherwise specified Symbol Pd VF RqJA Tj, TSTG Value to +175 Unit mW V K/W °C
Characteristic Forward Voltage = 200mA Thermal Resistance, Junction to Ambient Air (Note 2) Operating and Storage Temperature Range Notes:
1. Tested with Pulses, 20ms. 2. Valid provided that Electrodes are kept at Ambient Temperature.
1. Tested with pulses = 20 ms. 2. Valid provided that electrodes are kept at ambient temperature.
VZ, ZENER VOLTAGE (V) Fig. 1, Zener Current vs Zener Voltage
25 20 VZ, ZENER VOLTAGE (V) Fig. 8, Zener Current vs Zener Voltage
TA, AMBIENT TEMPERATURE (°C) Fig. 3, Power Dissipation vs Ambient Temperature
15 20 VZ, ZENER VOLTAGE (V) Fig. 4, Differential Zener Impedance
VZ, ZENER VOLTAGE (V) Fig. 5, Junction Capacitance vs Zener Voltage
MINI MELF,Smd mini melf,zener mini melf,mini melf package,mini melf resistor,mini melf diode,mini melf resistor datasheet
Changzhou Changyuan Electronic Co., Ltd. , https://www.cydiode.com