Intersil , a global leader in high-performance analog mixed-signal semiconductor design and manufacturing, today announced the availability of the latest version of the breakthrough ISL8200M DC/DC power module for the harsh applications of defense and avionics, the ISL8200MM .
The ISL8200MM point-of-load DC/DC power module complies with the specifications of the US Defense Supply Center (DSCC) VID V62/10608. It provides a complete switch mode Power Supply in a single package - military grade temperature electrical performance from -55 ° C to +125 ° C, and uses tin-lead materials to ensure maximum long-term reliability. The package and test records made by date/tracking code distribution provide full traceability, and Intersil also provides enhanced process change notifications. Combined with parallel load current scalability and extended leads on its QFN package, the ISL8200MM is ideal for defense communications equipment, radar, sonar, defense ground vehicles and smart regulatory applications.
The ISL8200MM uses Intersil 's patented current-sharing architecture to reduce the noise sensitivity of PCB layouts when multiple modules are used in parallel. The device contains almost all the components needed for a plug-and-play solution, replacing up to 40 different external components. This high level of integration simplifies and speeds up the design while reducing the power management footprint.
Efficient thermal 23-lead 15 mm x 15 mm QFN package with large thermal pad on the bottom supports an output power rating of up to 60 watts. Internal high-power components such as power MOSFETs and inductors are soldered directly to the thermal pad to support efficient heat transfer from the module to the PCB. The typical thermal resistance (θ JA) produced by using a thermal via on the PCB is only 13 ° C / W. Since most heat transfer is through the PCB, airflow is generally not required.
The module's QFM package has exposed leads around it for pin commissioning and solder joint verification. The very small 2.2mm thickness of the ISL8200MM allows it to be mounted on the underside of the PCB along with other thin components.
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