First, the technical background
LED light source is the focus of the 21st century light source market. As a new type of energy-saving and environmentally-friendly green light source product, LED is bound to be the future development trend, and it is called the fourth generation new light source revolution. It has the advantages of long life, high luminous efficiency, high stability, good safety, no mercury, no radiation, low power consumption and so on. However, the lack of high-efficiency and low-cost integrated light source industry technology is currently the bottleneck restricting the rapid development of white LED indoor general illumination at home and abroad, and is a common problem to be solved.
The packaging technology "COMMB-LED high-efficiency integrated surface light source" is a unique and innovative technology form of the LED industry. It has independent intellectual property rights and is protected by patent clustering formed by numerous patents and software copyrights. Its high cost performance characteristics. It will gradually become the mainstream packaging technology for the entire LED indoor lighting source.
The meaning of COMMB-LED light source technology is explained as the high-efficiency integrated surface light source technology of LED chip directly attached to the high-reflection mirror metal substrate. This technology eliminates the bracket concept, electroless plating, no reflow soldering, no patching process, so The process is reduced by nearly one-third and the cost is saved by one-third.
Second, the domestic LED industry technology level
Currently, LED packaging is available in a variety of forms. However, the overall application of semiconductor packaging technology to adapt to different applications, different dimensions, heat dissipation schemes and lighting effects, the package form is also different. LEDs are classified into package types, such as Lamp-LED, TOP-LED, Side-LED, SMD-LED, High-Power-LED, Flip Chip-LED, and COB LED.
In general, COB LED packaging technology is the mainstream technical solution for LED general lighting industry that is recognized by domestic and foreign industries. The LED general lighting industry in the world is striving to find cost-effective production solutions.
However, in the above package form, no matter what kind of LED, it is necessary to design a reasonable package form for different application occasions and lamp types, because only the cost performance and the comprehensive performance of the light source can be packaged as the light source product of the terminal, so that a good practical application can be obtained. Different from the above several package forms, the high-efficiency and low-power integrated package indoor lighting source built by our company's 39 patent groups adopts the vertical integration and packaging technology of chips and lamps, and is self-contained, widely used in indoor lighting such as LED lights. Tube, LED bulb, downlight, etc. It has a high degree of integration, greatly reducing the packaging process and the assembly process of the luminaire, improving the automation and operation efficiency, reducing the cost and improving the reliability of the product quality. Not only the products are environmentally friendly, but also the production process is clean, low noise and no pollution.
Third, the development trend of LED package light efficiency
As can be seen from the above figure: In 2011, the single LED light efficiency has reached the package level of 150Lm/W, and it is expected to reach the level of 200Lm/W by 2013. It will be three times that of the current fluorescent energy-saving lamp! Therefore, it is highly luminous. The use of dysfunction has been eliminated, and cost reduction has become a major obstacle to popularization.
Fourth, the principle of COMMB-LED technology
This "high-efficiency COMMB-LED surface light source integrated packaging technology" is a new technology formed after deep excavation of COB LED packaging technology. The imported mirror aluminum substrate with high reflectivity is used as the direct carrier of LED chip, through independent innovative insulating injection electrode. Structure, LED solid crystal, wire bonding, dispensing process innovation of the entire industry chain, the use of self-developed intelligent special plane to form a core software and hardware patent technology, fully improve the chip's excitation efficiency, reduce light loss and thermal resistance, Excluding complex cup injection molding and PCB, SMT, reflow soldering and other processes, to meet the high efficiency integration requirements of the current LED industry, creatively solve the industrial bottleneck of high quality, long life and low cost of indoor general lighting.
Fifth, the technical level reached by COMMB-LED
"High-efficiency COMMB-LED surface light source integrated packaging technology" is a new type of COB-LED package light source technology developed on the basis of the existing COB-LED packaging technology. The technology fully combines the high luminous efficiency of indoor general illumination. No glare. No flicker. The use characteristics of high-definition finger, from chip to package to the whole system of lamps, vertical integration of technology in the whole industry chain; greatly reducing and optimizing the process, The integrated packaging efficiency is improved, the cost is reduced, the reliability is improved, and the one-time investment cost of the device is reduced, so that China has broken through the foreign patent packaging in the field of white LED package COB-LED technology and entered the world first, forming a unique Chinese The COMMB-LED integrated surface light source technology.
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