Covering multiple frequency bands with one chip, making "Global Access" possible

At present, the frequency bands used for 5G communication in different countries are different. China is in the frequency range of 24.75-27.5GHz and 37-42.5GHz, Europe is in the frequency range of 24.25-27.5GHz, and Japan and South Korea adopts 26.5-29.5GHz. In this case, if the mobile phone chip does not support so many different frequency bands, the mobile phone cannot communicate normally when traveling abroad. Can we develop a wide-band "universal chip" that covers all of the above different frequency bands?

The Science and Technology Daily reporter learned from the University of Electronic Science and Technology that Zhang Jingzhi, a Ph.D. student at the School of Electronic Science and Engineering (Demonstration Microelectronics Institute), published a paper by the first author at the International Solid State Circuits Conference (ISSCC) held 2018 ago. A "current boosting technology based on a strong coupling transformer" has initially realized the use of a chip to cover all frequency bands, making "global communication" possible.

Zhang Jingzhi completed the above ideas in the research results presented at the International Solid State Circuits Conference in 2018. He designed two 5G "universal chips" in the paper, the large specifications are 910 microns & TImes; 920 microns, the small is 700 microns & TImes; 670 microns, the area is less than 1 square millimeter, the size is equivalent to the cross of a needle section. This small chip has a "compassionate" broad "heart", which greatly enhances the working bandwidth of the injection locking frequency multiplier. Its professional name is "Ultra-wideband injection locking based on CMOS (Complementary Metal Oxide Semiconductor) process. Frequency converter." In comparison with the industry's most advanced technology, the technology increases the operating bandwidth by 5.2 times with only 2 times the power consumption. It also solves the "big bandwidth design of low phase noise sources" in the millimeter wave band. The challenge provides a feasible solution for the design of ultra-wideband low phase noise signal sources in the millimeter wave field, and has practical significance for high frequency multi-band applications of 5G communication.

“The input current and the operating bandwidth are positively correlated. If you want to increase the bandwidth of the circuit, you have to find ways to increase the input current. To increase the input current, one way is to increase the input signal, but in general, the external input signal size is Fixed, so this road does not work. There is also a way to increase the gain of the input pole, but the industry has optimized the input pole very well, it is unlikely to further improve the basics." Talking about chip development ideas, Zhang Jingzhi said, After constantly asking questions and continually negating himself, he proposed a breakthrough idea: Can you use a passive circuit to boost the current and then insert a transformer, so that the current can be increased several times while the bandwidth is increased several times. In the end, he and the team put this idea into practice and succeeded. "This new chip is application-oriented and closely integrated with the industry from the beginning. With the advent of the 5G communication era and the gradual promotion of various applications, our chips will also usher in better development opportunities." .

Covering multiple frequency bands with one chip, making "Global Access" possible

On the left is the differential output chip, which is the verification module of the core circuit; on the right is the quadrature output chip, which is a complete chip that can be used in the 5G system.

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